In-mold electronics (IME) is a combination of IMD/IML in-mold injection technology and flexible printed circuits to produce 3D shapes with embedded circuits of varying complexity.

After recent developments, in-module electronics (IME) or in-module structured electronics (IMSE) are about to enter a period of rapid growth, with the overall market value forecast to exceed $1.11 billion by 2029. This is part of a growing global trend in 3D structured electronics, which enables more reliable products to be produced without the need for assembly and packaging through in-mold electronics.

In-mold electronic applications begin with multilayer decorative, conductive, and dielectric inks screen-printed on polycarbonate or mylar sheets on sub-surfaces. After curing, the printed film is thermally shaped into a 3D shape and the sheet is punched out. The thin 3D model of the image is placed in an injection mold and a clear or coloured resin is injected behind it. The resulting part is a functional hard plastic piece.

IMD/IML in-mold injection technology is combined with printed capacitive sensors inside the injection parts. The surface is decorative film, the material is generally PC, PET, PMMA, PP, PA, used for printing patterns of ink layer UV, water, solvent, injection materials are generally PC, PC/ABS, ABS, PMMA, PP and so on.

IMD/IML in-mold injection integrated touch switch, in fact, is to add a conductive layer. It replaces the previously manual flexible circuit boards with fewer restrictions, 90 degree bending angles, fewer wires and nodes, and thinner.